POLYAMIDE-IMIDE COPOLYMER FILM AND METHOD OF PREPA

专利名称：POLYAMIDE-IMIDE COPOLYMER FILM AND

METHOD OF PREPARING POLYAMIDE-IMIDECOPOLYMER

发明人：Hyo Jun Park,Hak Gee Jung申请号：US143475申请日：20120927

公开号：US20140243482A1公开日：20140828

摘要：Disclosed herein is a polyamide-imide copolymer film, comprising a copolymerresin in which a unit structure derived from TFDB (2,2′-bistrifluoromethyl-4,4′-biphenyldiamine), a unit structure derived from 6FDA (4,4′-(hexa-fluoroisopropylidene)diphthalicanhydride), a unit structure derived from BPDA (3,3′,4,4′-biphenyltetracarboxylicdianhydride) and a unit structure derived from TPC (terephthaloyl chloride or 1,4-benzenedicarbonyl chloride) are copolymerized, wherein the copolymer resin has aweight average molecular weight of 10,000˜400,000.

申请人：KOLON INDUSTRIES, INC.

地址：Gwacheon-si, Gyeonggi-do KR

国籍：KR

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