专利名称：ELECTRONIC PART AND MANUFACTURING
METHOD THEREOF
发明人：HIMORI, TSUYOSHI,HIRAI, SHOGO申请号：EP04819794申请日：20041129公开号：EP1581032A4公开日：20091021
摘要：An electronic component includes conductive pattern (2) on insulating substrate(1), a metal film formed by a plating method on a surface of conductive pattern (2), andmetal oxide layer (3) formed by oxidizing the metal film on the surface of conductivepattern (2). This structure allows forming a thin and uniform insulating film on conductivepattern (2), so that the highly reliable electric component is obtainable although itsconductive pattern (2) has a high aspect ratio.
申请人：PANASONIC CORPORATION
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