Method for manufacturing wiring substrate

专利名称：Method for manufacturing wiring substrate发明人：Hidemichi Furiata,Satoshi Kimura,Minoru

Marumo

申请号：US11091919申请日：20050328公开号：US075850B2公开日：20090908

专利附图：

摘要：A method for manufacturing a wiring substrate includes the steps of: (a)patterning a surface-active agent on a substrate having first and second areas to beremained on the first area; (b) removing residues of the surface-active agent in thesecond area by wet-etching with an alkali; (c) patterning a catalyst to be remained on oneof the second area of the substrate and the surface-active agent; and (d) depositing ametal layer on the catalyst to thereby form a wiring.

申请人：Hidemichi Furiata,Satoshi Kimura,Minoru Marumo

地址：Nagano JP,Nagano JP,Nagano JP

国籍：JP,JP,JP

代理机构：Harness, Dickey & Pierce, P.L.C.

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