METHOD FOR MANUFACTURING WIRING SUBSTRATE

专利名称：METHOD FOR MANUFACTURING WIRING

SUBSTRATE

发明人：Satoshi KIMURA,Hidemichi

FURIHATA,Takeshi KIJIMA

申请号：US11680801申请日：20070301

公开号：US20070212876A1公开日：20070913

专利附图：

摘要：A method for manufacturing a wiring substrate by an electroless platingmethod that precipitates metal without using a plating resist is provided. The method

includes the steps of (a) providing a catalyst layer having a predetermined pattern on asubstrate; (b) dipping the substrate in an electroless plating solution to therebyprecipitate metal on the catalyst layer to provide a first metal layer; (c) washing a topsurface of the substrate with water; and (d) dipping the substrate in an electrolessplating solution to thereby precipitate metal on the first metal layer to provide a secondmetal layer.

申请人：Satoshi KIMURA,Hidemichi FURIHATA,Takeshi KIJIMA

地址：Fujimi JP,Chino JP,Matsumoto JP

国籍：JP,JP,JP

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