Method of encapsulating a microelectronic assembly

专利名称：Method of encapsulating a microelectronic

assembly utilizing a barrier

发明人：John W. Smith,Joseph Fjelstad申请号：US08/984933申请日：19971204公开号：US06130116A公开日：20001010

摘要：A method of encapsulating a microelectronic assembly includes providing oneor more microelectronic assemblies having one or more elements defining exteriorsurfaces and an array of terminals exposed at the exterior surfaces, the one or moreelements defining one or more apertures through the exterior surfaces. A layer of acurable barrier material is then provided on a supporting element. The barrier layer hasopenings therein in a pattern corresponding to the array of terminals on the one or moremicroelectronic assemblies. The supporting element and the one or more

microelectronic elements are then assembled together so that the layer of barriermaterial contacts the exterior surfaces and covers the apertures and so that theopenings in the layer of barrier material are aligned with the terminals. The barriermaterial is then cured while in contact with the exterior surfaces to thereby form a barrierlayer covering the apertures. Next, a curable liquid encapsulant is applied to themicroelectronic assemblies, whereby the barrier layer prevents the curable liquidencapsulant from flowing through the apertures, and the encapsulant is cured. Thebarrier layer and the supporting element cooperatively surround the terminals exposedat the exterior surfaces to protect the terminals from contaminants.

申请人：TESSERA, INC.

代理机构：Lerner, David, Littenberg, Krumholz & Mentlik, LLP

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