专利名称：LEADFRAME, SEMICONDUCTOR PACKAGE
INCLUDING A LEADFRAME AND METHODFOR FORMING A SEMICONDUCTORPACKAGE
发明人：Thomas BEMMERL,Azlina KASSIM,Nurfarena
OTHMAN
申请号：US1537申请日：20180212
公开号：US20180233438A1公开日：20180816
专利附图：
摘要：A leadframe, that is to be incorporated into a semiconductor housing isprovided. The leadframe may include a first die pad, a second die pad and a plurality ofcontact pads. A lower surface of the contact pads and a lower surface of the first die padare arranged in a first plane. An upper surface of the second die pad is arranged in asecond plane distant from the first plane by an overall thickness of the semiconductorpackage.
申请人：Infineon Technologies AG
地址：Neubiberg DE
国籍：DE
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